Advanced packaging signal and power integrity analysis
This position involves delivering advanced packaging and 3DIC analysis flows for foundry and customer solutions primarily using Cadence SI/PI and Thermal tools Sigrity, Clarity and Celcius
Job Summary
This position involves delivering advanced packaging and 3DIC analysis flows for foundry and customer solutions primarily using Cadence SI/PI and Thermal tools Sigrity, Clarity and Celcius.
Work in a team environment creating and implementing 3DIC reference flows and designs.
Cadence is the only company that provides the expertise and tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging to boards and to systems.
Matching Summary
This position involves delivering advanced packaging and 3DIC analysis flows for foundry and customer solutions primarily using Cadence SI/PI and Thermal tools Sigrity, Clarity and Celcius.
Skills & Requirements
Must-have
SI/PI and Thermal Analysis tools
Sigrity, Clarity and Celcius
advanced packaging signal and power integrity analysis
3DIC configurations
problem-solving skills
Nice-to-have
continuous learning
expanding professional skill sets
Fortune 100 Best Companies to Work For
Great Place to Work globally
Key Requirements
Complete Bachelor’s degree in Electrical or Electronics Engineering
Experience with package design
Experience with Cadence SI/PI/Thermal tools
Strong knowledge of advanced packaging concepts
Strong knowledge of 2.5D, 3DIC and stacked die technologies
Excellent verbal and written communication skills in English and Portuguese