The job posting is for a Senior TCB Application & Technical Sales Engineer in Admiralty, Singapore, focusing on semiconductor packaging and technical sales. The role requires extensive experience in TCB, advanced packaging techniques, and collaboration with various engineering teams, offering a competitive salary based on experience
Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps and translate requirements into internal equipment specifications.
Candidates will lead machine qualification activities including FAT and SAT while supporting advanced packaging applications like HBM and Chiplet Integration.
The position requires troubleshooting complex bonding issues such as non-wet, misalignment, voids, delamination, and warpage using DOE methodologies.
Matching Summary
Match Score: 85
The job posting is for a Senior TCB Application & Technical Sales Engineer in Admiralty, Singapore, focusing on semiconductor packaging and technical sales. The role requires extensive experience in TCB, advanced packaging techniques, and collaboration with various engineering teams, offering a competitive salary based on experience.
Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Advanced packaging applications knowledge
Troubleshooting bonding issues expertise
DOE and process characterization skills
Bachelor's or Master's degree in engineering
Nice-to-have
Fluxless or N2 bonding environment experience
OSAT, IDM or equipment environment background
HBM / CoWoS / 2.5D / 3D packaging exposure
Key Requirements
5–15 years of semiconductor packaging experience
Hands-on TCB and Flip Chip experience
Degree in Materials Science, Mechanical, Electrical, or Semiconductor Engineering