Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) team, where you'll play a pivotal role in shaping the future of assembly and packaging technologies
Job Summary
Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) team, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages.
This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry.
Matching Summary
Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) team, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
Skills & Requirements
Must-have
Thermal Compression Bonding process
Advanced packaging roadmap
Statistical methods and DOE
Process data analysis
Cross-functional team collaboration
Nice-to-have
Proactive approach to challenges
Thrive under tight timelines
Influence and collaborate across teams
Key Requirements
Bachelor's degree in STEM field
Familiarity with semiconductor assembly equipment
Master's degree with First Class Honors
Experience with data science tools
Proficiency in statistical methods
Fundamental understanding of semiconductor packaging