Product Engineer (pkg Pe Mfg), Heterogeneous Integration Group(hig), High Bandwidth Memory (hbm)
Micron Technology
Singapore
Onsite with international travel.
Assembly related coverage improvement
Cross-functional collaboration
Root cause analysis skills
Micron Technology is seeking a Product Engineer for its High Bandwidth Memory (HBM) team in Singapore. The ideal candidate will have a background in electrical, electronic, or mechanical engineering, with over three years of experience in the semiconductor industry, focusing on product engineering and packaging
Job Summary
Micron Technology is a world leader in innovating memory and storage solutions.
You will collaborate across functions to meet strategic and tactical objectives.
The role involves making final decisions on risk analysis and project prioritization.
Matching Summary
Match Score: 85
Micron Technology is seeking a Product Engineer for its High Bandwidth Memory (HBM) team in Singapore. The ideal candidate will have a background in electrical, electronic, or mechanical engineering, with over three years of experience in the semiconductor industry, focusing on product engineering and packaging.
Skills & Requirements
Must-have
Assembly related coverage improvement
Cross-functional collaboration
Root cause analysis skills
Nice-to-have
Passionate about people leadership
Dedicated and highly motivated
Flexible approach to dynamic roles
Key Requirements
Bachelors/Masters in Electrical/Electronic/Mechanical Engineering
More than 3 years of experience in semiconductor industry
Product Engineering and Packaging experience preferred