Advanced Packaging Process Support Engineer

Applied Materials

Hwaseong, South Korea
Hybrid
5-10 years semiconductor process experience
Die-to-wafer bonding technology expertise
On-site fab shift work availability
Applied Materials seeks an experienced Advanced Packaging Process Support Engineer to provide technical support for KINEX bonding systems in semiconductor manufacturing. The role involves hands-on process engineering, troubleshooting, and collaboration with customer and R&D teams to enhance die-to-wafer bonding processes

Job Summary

  • This role focuses on supporting Applied Materials KINEX bonding equipment for advanced semiconductor packaging environments.
  • The engineer will act as a process owner for Hybrid Bonding technologies, collaborating closely with customer engineering teams.
  • Candidates must be willing to work night shifts and rotational schedules in physically demanding fab environments.

Matching Summary

Match Score: 85

Applied Materials seeks an experienced Advanced Packaging Process Support Engineer to provide technical support for KINEX bonding systems in semiconductor manufacturing. The role involves hands-on process engineering, troubleshooting, and collaboration with customer and R&D teams to enhance die-to-wafer bonding processes.

Skills & Requirements

Must-have

  • 5-10 years semiconductor process experience
  • Die-to-wafer bonding technology expertise
  • On-site fab shift work availability
  • Root cause analysis and DOE execution
  • Hybrid Cu / Hybrid Capa bonding knowledge

Nice-to-have

  • Applied Materials KINEX system experience
  • Master's degree or PhD in related field
  • Strong communication and interpersonal skills
  • Willingness to travel 25% of the time
  • Experience with backend packaging processes

Key Requirements

  • Bachelor's degree in Materials Science or Engineering
  • 5-10 years experience in semiconductor process engineering
  • English proficiency for technical documentation

Work Rights

Not specified

Tailored Resume

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