Photolithography Process Development Engineer (advanced Patterning)

Texas Instruments

Lehi, UT, United States
Advanced patterning techniques
Lithography simulation software
Advanced metrology
This role focuses on the next generation 20nm-class logic technologies, with primary responsibility for photolithography and litho-etch integration, including advanced patterning techniques such as pitch doubling (SADP/LELE)

Job Summary

  • This role focuses on the next generation 20nm-class logic technologies, with primary responsibility for photolithography and litho-etch integration, including advanced patterning techniques such as pitch doubling (SADP/LELE).
  • Responsibilities include modeling & simulation, metrology & yield improvement, vendor & subsystem interaction, data analysis & SPC, pathfinding & technology transfer, and photo process characterization.
  • We are seeking a highly skilled and hands-on Process Development Engineer with deep expertise in advanced-node semiconductor manufacturing.

Matching Summary

This role focuses on the next generation 20nm-class logic technologies, with primary responsibility for photolithography and litho-etch integration, including advanced patterning techniques such as pitch doubling (SADP/LELE).

Skills & Requirements

Must-have

  • advanced patterning techniques
  • lithography simulation software
  • advanced metrology
  • process data analysis
  • litho-etch integration
  • resolution enhancement techniques

Nice-to-have

  • collaborative team-player mindset
  • data-driven approach
  • fast-paced environments

Key Requirements

  • Master's in Electrical Engineering, Materials Science, Physics, or related discipline
  • 5+ years of industry experience
  • Direct, hands-on experience with 22nm node or comparable advanced nodes
  • Proficiency with lithography simulation software

Work Rights

Not specified

Tailored Resume

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