Intel is shaping the future of technology, pushing forward fields like AI, analytics, and cloud-to-edge technology to create a better future for the entire world
Job Summary
Intel is shaping the future of technology, pushing forward fields like AI, analytics, and cloud-to-edge technology to create a better future for the entire world.
This role leads the technical integration of external memory and/or foundry silicon technologies into Intel's advanced packaging platforms, driving comprehensive chip-to-package interaction assessments.
Intel offers a total rewards package that includes competitive pay, stock bonuses, and benefit programs for health, retirement, and vacation.
Matching Summary
Intel is shaping the future of technology, pushing forward fields like AI, analytics, and cloud-to-edge technology to create a better future for the entire world.
Salary
Base: $155,520.00-298,440.00 USD; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
external memory integration
foundry silicon integration
advanced packaging platforms
chip-to-package interaction assessments
Si far back-end design rules
technical program management
Nice-to-have
thrive in ambiguous environments
executive audience communication
strategic platform planning
Key Requirements
BA degree with 6+ years experience or Master's with 4+ years or PhD with 2+ years
3+ years microelectronic packaging process development
3+ years semiconductor packaging assembly integration
3+ years semiconductor technical program management
3+ years managing semiconductor suppliers or customer programs