Senior Substrate Program Managers

Intel

Taipei, Taiwan
Onsite
Substrate supplier collaboration
Advanced packaging substrate technology
Capacity qualification at suppliers
Work at the forefront of packaging technologies essential for next-generation AI devices

Job Summary

  • Work at the forefront of packaging technologies essential for next-generation AI devices.
  • Collaborate with substrate suppliers worldwide to drive innovation and scalability.
  • Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.

Matching Summary

Work at the forefront of packaging technologies essential for next-generation AI devices.

Skills & Requirements

Must-have

  • Substrate supplier collaboration
  • Advanced packaging substrate technology
  • Capacity qualification at suppliers
  • On-site supplier engineering collaboration
  • Substrate lead time reduction roadmaps
  • Process Control System adherence

Nice-to-have

  • Thrive on solving complex challenges
  • Challenge conventional approaches
  • Build lasting supplier partnerships
  • Flexibility to adapt to evolving scopes
  • Engage effectively with supplier management

Key Requirements

  • Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience
  • 6+ years of experience in fab back-end or substrate manufacturing
  • Experience in capacity management
  • Experience in lead time analysis
  • Experience in structured problem solving
  • Experience in supplier influence
  • Experience in stakeholder management

Work Rights

Not specified

Tailored Resume

Cover Letter