Principal/senior Engineer, Aptd Cem - Advanced Packaging Integration Engineering
Micron Technology
Semiconductor process integration experience
Python r sql statistical analysis proficiency
Advanced package technology development
The role focuses on developing and enabling advanced packaging technologies to meet performance, cost, and manufacturability requirements for high bandwidth memory products
Job Summary
The role focuses on developing and enabling advanced packaging technologies to meet performance, cost, and manufacturability requirements for high bandwidth memory products.
Candidates will drive yield improvements through silicon package integration innovation and collaborate with cross-functional teams including Probe, Test, and Product Engineering.
Micron is seeking a team member to support the transition from new product development to high volume manufacturing while ensuring quality and reliability standards.
Matching Summary
The role focuses on developing and enabling advanced packaging technologies to meet performance, cost, and manufacturability requirements for high bandwidth memory products.
Skills & Requirements
Must-have
Semiconductor process integration experience
Python R SQL statistical analysis proficiency
Advanced package technology development
Yield improvement and defect analysis
Root cause problem solving skills
Nice-to-have
Experience with Visual Basic automation
Familiarity with E3 FDC RMS systems
Strong data analytics dashboarding capabilities
Collaboration across global engineering teams
Tenacity to work under tight timelines
Key Requirements
B.S/M.S./Ph.D. in Engineering or related field
2+ years semiconductor process integration experience
Knowledge of post-fab wafer finish and assembly processes