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Nvidia Corporation is seeking a Senior Package Modeling Engineer to join its Advanced Technology Group, focusing on advanced semiconductor package developments. The ideal candidate will have extensive experience in Finite Element Analysis (FEA) and a strong background in mechanical engineering or materials science.
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Job Summary
Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
Your contributions will help determine the future of semiconductor packaging and enable NVIDIA to continue competing at the highest levels.
Matching Summary
Match Score: 75
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Nvidia Corporation is seeking a Senior Package Modeling Engineer to join its Advanced Technology Group, focusing on advanced semiconductor package developments. The ideal candidate will have extensive experience in Finite Element Analysis (FEA) and a strong background in mechanical engineering or materials science.
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Salary
Base: 124,000 USD - 195,500 USD; Bonus/Equity: Eligible for equity; Benefits: Eligible for benefits
Skills & Requirements
Must-have
Finite Element Analysis (FEA)
Thermo-mechanical behavior analysis
Semiconductor packaging architecture
Material properties analysis
FEA modeling tools expertise
Nice-to-have
Cooperative environment commitment
Cross-functional team collaboration
Influential mentorship
Key Requirements
MS or PhD or equivalent experience
5+ years of FEA modeling/simulation experience
Familiarity with JEDEC reliability standards
Understanding of advanced semiconductor packaging materials