Package Health - Principal/staff/senior Engineer, Advanced Packaging Technology Development
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Yishun, Singapore
Sgd 5,000 - 10,000 / monthly pm
On-site
Dft strategies for advanced packaging
Simulation of mechanical thermal electrical performance
Package characterization and reliability testing
Micron Semiconductor Asia Operations is seeking a Package Health Engineer to contribute to the development and execution of package health monitoring and reliability testing for high-performance memory products. The ideal candidate will possess a background in Electrical Engineering or Materials Science, with hands-on experience in semiconductor packaging and data analysis
Job Summary
Micron’s Advanced Packaging Technology Development team delivers package development for high performance memory products and transfers to manufacturing.
The Package Health Engineer will contribute to package health monitoring, simulation, characterization, and reliability testing to ensure robust packaging solutions.
The role involves collaboration with data scientists to build predictive models and support root cause analysis for reliability issues.
Matching Summary
Match Score: 85
Micron Semiconductor Asia Operations is seeking a Package Health Engineer to contribute to the development and execution of package health monitoring and reliability testing for high-performance memory products. The ideal candidate will possess a background in Electrical Engineering or Materials Science, with hands-on experience in semiconductor packaging and data analysis.
Salary
SGD 5,000 - 10,000 / Monthly
Skills & Requirements
Must-have
DFT strategies for advanced packaging
Simulation of mechanical thermal electrical performance
Package characterization and reliability testing
Data analysis and scripting with Python MATLAB JMP
Semiconductor packaging process knowledge
DRAM or ASIC product testing expertise
Nice-to-have
Experience with AI ML tools
Familiarity with JEDEC reliability standards
Strong problem-solving and documentation skills
Key Requirements
Bachelor’s or Master’s degree in Electrical Engineering or related field
2+ years semiconductor industry experience
Hands-on experience with simulation tools and test equipment
Proficiency in statistics data analysis scripting
Knowledge of semiconductor packaging materials and processes