POET Technologies Pte. Ltd. is seeking a Senior Engineer in Assembly to support their research and development in Photonics IC Packaging. The ideal candidate should have substantial experience in the semiconductor industry and be proficient in assembly and testing processes
Job Summary
The role supports research and development activities in Photonics IC Packaging through machine setup, assembly, testing, and troubleshooting.
Candidates will analyze packaging process performance metrics including yield, manufacturing cost, and cycle time to drive continuous improvement.
The successful engineer will coordinate with internal teams to manage materials and ensure readiness for advanced assembly operations.
Matching Summary
Match Score: 85
POET Technologies Pte. Ltd. is seeking a Senior Engineer in Assembly to support their research and development in Photonics IC Packaging. The ideal candidate should have substantial experience in the semiconductor industry and be proficient in assembly and testing processes.
Skills & Requirements
Must-have
5 years semiconductor industry experience
Die-assembly tools operation
Flip-chip bonder expertise
Wire bonder proficiency
Active device assembly on interposers
Nice-to-have
CAD drawing tool familiarity
Photonics packaging process knowledge
Continuous improvement initiative support
Cross-functional team collaboration
Key Requirements
Diploma or Bachelor's Degree in Engineering
Minimum 5 years relevant working experience
Hands-on experience with die-assembly tools
Experience with flip-chip bonders and wire bonders