Advanced Packaging RD Etch Manager

TSMC

Taiwan
On-site
Master's or ph.d. in chemical engineering
10 years semiconductor technology experience
Advanced plasma etch process development
TSMC is seeking an Advanced Packaging RD Etch Manager for their Taiwan facility, focusing on the development and sustainment of advanced etch processes. The ideal candidate will have extensive experience in semiconductor technology, particularly in plasma etch processes, with a strong emphasis on collaboration and communication across teams

Job Summary

  • Lead the development and sustainment of advanced etch processes to meet yield, reliability, and manufacturability requirements.
  • Collaborate with cross-functional teams including module, integration, FAB teams, and suppliers to ensure successful project execution.
  • Fostering a global inclusive workplace reflects TSMC's core values and is essential for future success.

Matching Summary

Match Score: 85

TSMC is seeking an Advanced Packaging RD Etch Manager for their Taiwan facility, focusing on the development and sustainment of advanced etch processes. The ideal candidate will have extensive experience in semiconductor technology, particularly in plasma etch processes, with a strong emphasis on collaboration and communication across teams.

Skills & Requirements

Must-have

  • Master's or Ph.D. in Chemical Engineering
  • 10 years semiconductor technology experience
  • Advanced plasma etch process development

Nice-to-have

  • Cross-functional collaboration skills
  • Global inclusive workplace values
  • Strong problem-solving abilities

Key Requirements

  • Master's or Ph.D. degree required
  • At least 10 years experience in semiconductor tech
  • 6 years relevant experience in advanced plasma etch preferred

Work Rights

Not specified

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