Advanced Packaging Yield Analysis And Defect Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Advanced packaging yield analysis
Statistical methods and machine learning
Inline defect metrology knowledge
The role focuses on driving yield and defect improvement across the Advanced Packaging Technology and Manufacturing portfolio

Job Summary

  • The role focuses on driving yield and defect improvement across the Advanced Packaging Technology and Manufacturing portfolio.
  • Candidates must possess strong analytical skills to extract insights from large datasets using statistical methods and machine learning.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

The role focuses on driving yield and defect improvement across the Advanced Packaging Technology and Manufacturing portfolio.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation

Skills & Requirements

Must-have

  • Advanced Packaging Yield Analysis
  • Statistical Methods and Machine Learning
  • Inline Defect Metrology Knowledge
  • Data Analysis with JMP or Python
  • Cross-functional Team Leadership

Nice-to-have

  • Tolerance of ambiguity and flexibility
  • Strong interpersonal communication skills
  • Positive can-do attitude
  • Experience with DFT and Sort/Test
  • Ability to work autonomously

Key Requirements

  • US Citizenship Required
  • Bachelor's degree plus 6+ years experience OR Master's plus 4+ years OR PhD plus 2+ years
  • 5+ years of data analysis experience
  • Ability to obtain and maintain US Government clearance

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter