Package Design Engineer

FLIR

Saint-Egrève, , France
Microelectronics packaging design flow
Organic and ceramic multi-layer packages
Technical interface with vendors and assembly houses
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, ensuring successful routing and design reviews while acting as the key technical interface with packaging vendors and assembly houses

Job Summary

  • The Package Design Engineer leads the complete design flow of advanced microelectronic packages, ensuring successful routing and design reviews while acting as the key technical interface with packaging vendors and assembly houses.
  • Teledyne e2v offers a human-scale site where your contribution truly matters, with opportunities for career development in technical expertise, project management, and international exposure within a global group.
  • The company promotes a culture built on respect, integrity, responsibility, and citizenship, with commitments to QHSE/CSR goals, gender equality, and a flexible work environment including teleworking.

Matching Summary

The Package Design Engineer leads the complete design flow of advanced microelectronic packages, ensuring successful routing and design reviews while acting as the key technical interface with packaging vendors and assembly houses.

Skills & Requirements

Must-have

  • microelectronics packaging design flow
  • organic and ceramic multi-layer packages
  • technical interface with vendors and assembly houses
  • package design layout under Cadence APD
  • electrical, thermal, mechanical simulations
  • design rule checks (DRC) compliance
  • customer needs identification and specification

Nice-to-have

  • experience in imaging and assembly
  • knowledge of electrical modelisation tools
  • thermal simulation expertise
  • system and sub-system development experience
  • multilingual communication skills
  • teamwork and adaptability
  • continuous improvement mindset

Key Requirements

  • background in microelectronics, electronics, material science or micromechanics
  • confirmed experience in packaging design
  • mastery of package design flow and layout tools
  • experience managing package vendors and assembly houses
  • English B2 minimum and French oral and written proficiency
  • knowledge of electrical and thermal simulation software
  • Spanish language skills are a plus

Work Rights

Not specified

Tailored Resume

Cover Letter