Advanced Package Technology Engineer

Broadcom

Multiple Locations
Base: $120,000 - $192,000; bonus/equity: discretio...
2.5d / 3d package technology expertise
Advanced silicon fab and assembly processes
Thermal and mechanical modeling tools
This role involves working closely with silicon and package design teams, marketing, NPI, assembly/substrate suppliers, and customers to develop advanced packaging solutions

Job Summary

  • This role involves working closely with silicon and package design teams, marketing, NPI, assembly/substrate suppliers, and customers to develop advanced packaging solutions.
  • The position offers a competitive salary range, discretionary bonuses, equity awards, and a comprehensive benefits package including medical, dental, vision, 401(K) matching, and paid leave.
  • Broadcom is an equal opportunity employer committed to considering qualified applicants without regard to various protected characteristics and complies with applicable laws for leaves of absence.

Matching Summary

This role involves working closely with silicon and package design teams, marketing, NPI, assembly/substrate suppliers, and customers to develop advanced packaging solutions.

Salary

Base: $120,000 - $192,000; Bonus/Equity: Discretionary annual bonus and equity awards; Benefits: Medical, dental, vision, 401(K) matching, ESPP, paid leave

Skills & Requirements

Must-have

  • 2.5D / 3D package technology expertise
  • Advanced silicon fab and assembly processes
  • Thermal and mechanical modeling tools
  • Cross functional team collaboration
  • Project management with external partners
  • Signal integrity and structural reliability

Nice-to-have

  • Problem-solving and analytical skills
  • Flexible and agile work approach
  • Innovative solution development
  • Global communication and travel readiness
  • Team player with interpersonal skills

Key Requirements

  • Master's degree in Mechanical/Electrical/Electronics Engineering with 6+ years experience or PhD with 3+ years experience
  • 4 to 6 years hands-on experience in 2.5D / 3D development
  • Experience with advanced multi-layer ceramic/organic substrates and interposers
  • Knowledge of industry standards, quality systems, and regulations
  • Ability to manage multiple programs concurrently

Work Rights

Not specified

Tailored Resume

Cover Letter