Advanced Ic Packaging Software Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, US
Base: $111,030.00-211,200.00 usd; bonus/equity: no...
Hybrid
C/c++ programming experience
Experience with eda tools
Knowledge of ai and ml fundamentals
Intel is transforming the world with innovative technology and connected devices

Job Summary

  • Intel is transforming the world with innovative technology and connected devices.
  • The Advanced IC Packaging Software Engineer will work closely with customers on advanced packaging technologies.
  • Employees enjoy a competitive compensation package and a hybrid work model.

Matching Summary

Intel is transforming the world with innovative technology and connected devices.

Salary

Base: $111,030.00-211,200.00 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • C/C++ programming experience
  • experience with EDA tools
  • knowledge of AI and ML fundamentals

Nice-to-have

  • effective communication skills
  • analytical problem-solving skills
  • self-driven and results-oriented

Key Requirements

  • Bachelor's or Master's degree in relevant field
  • 2+ years of relevant experience
  • 1+ years of relevant experience for Master's degree holders

Work Rights

Not specified

Tailored Resume

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