Capillary Underfill Technology Development Module Engineer

Intel

Kulim, Malaysia
Onsite
Develops assembly processes and equipment
Optimizes manufacturing efficiency
Develops process and equipment specifications
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies

Job Summary

  • Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
  • Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.

Matching Summary

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

Skills & Requirements

Must-have

  • Develops assembly processes and equipment
  • Optimizes manufacturing efficiency
  • Develops process and equipment specifications
  • Evaluates silicon and package technologies
  • Ensures manufacturability of physical layout
  • Establishes material specifications
  • Develops new acceleration methods

Nice-to-have

  • Innovative solutions for future packaging
  • Fundamental understanding of failure mechanisms
  • Consultation on packaging problems
  • Continuous engagement with partner engineering

Key Requirements

  • Bachelor's or Master's degree
  • R&D in assembly and packaging
  • Statistical design of experiments
  • Problem-solving techniques

Work Rights

Not specified

Tailored Resume

Cover Letter