Senior Technical Solutions Engineer - Advanced Packaging

Intel Foundry

Phoenix, Arizona, US
Base: $160,980.00-311,040.00 usd; bonus/equity: st...
Hybrid
5+ years semiconductor experience
Bachelor's degree in engineering
Advanced packaging technical expertise
This role serves as the primary customer interface and voice of the customer for Intel Foundry's key Packaging and Test accounts

Job Summary

  • This role serves as the primary customer interface and voice of the customer for Intel Foundry's key Packaging and Test accounts.
  • The position requires developing comprehensive Statements of Work and managing the complete customer engagement lifecycle from design award through high-volume manufacturing.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

This role serves as the primary customer interface and voice of the customer for Intel Foundry's key Packaging and Test accounts.

Salary

Base: $160,980.00-311,040.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • 5+ years semiconductor experience
  • Bachelor's degree in Engineering
  • Advanced Packaging technical expertise

Nice-to-have

  • Post graduate degree in related field
  • Experience with 2.5D/3D Chiplets
  • Strong problem-solving analytical thinking

Key Requirements

  • Bachelor's degree in Electrical, Materials, Mechanical, or Chemical Engineering
  • 5+ years in Semiconductor Packaging, Assembly/Test, or Backend Manufacturing
  • Not eligible for Intel immigration sponsorship

Work Rights

Not specified

Tailored Resume

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