Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement
Job Summary
Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.
Conducts physical and technical failure analysis to identify defects causing inline yield loss and determines root cause using advanced characterization techniques.
Documents and communicates findings through technical reports and presentations to engineers, operators, and management, and provides recommendations for process, material, or equipment improvements.
Matching Summary
Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.
Salary
$70,670.00-116,640.00 USD
Skills & Requirements
Must-have
Failure analysis and defect characterization
SEM, EDX, X-ray, ion mill operation
Technical reporting and presentations
Backend shift operations support
Process, material, equipment improvement
Nice-to-have
Experience in semiconductor packaging
High-volume manufacturing environment
Tool ownership and maintenance
Advanced failure analysis techniques
Continuous learning and manufacturing excellence
Key Requirements
High School diploma with 10+ years of relevant experience
AA/AS degree with 6+ years of relevant experience
Bachelor's degree with 4+ years of relevant experience
US citizen or permanent resident (Green Card holder)