Tata Electronics Private Limited is seeking a Mold Process Engineer for their new semiconductor foundry, focusing on EOL assembly processes. The ideal candidate will have hands-on experience in the semiconductor industry, particularly in FOL or EOL processes, and will lead a team while ensuring quality and efficiency
Job Summary
Tata Electronics is building India's first AI-enabled state-of-the-art Semiconductor Foundry to produce chips for automotive and computing applications.
The role requires leading the wire bond team while ensuring all assembly processes meet strict manufacturing and quality requirements.
Candidates must have hands-on experience in Front-End or End-Of-Line semiconductor processes and the ability to troubleshoot complex equipment issues.
Matching Summary
Match Score: 85
Tata Electronics Private Limited is seeking a Mold Process Engineer for their new semiconductor foundry, focusing on EOL assembly processes. The ideal candidate will have hands-on experience in the semiconductor industry, particularly in FOL or EOL processes, and will lead a team while ensuring quality and efficiency.
Skills & Requirements
Must-have
Handson experience in FOL or EOL process
In-depth knowledge of wire bonding equipment
Lead and manage wire bond team
Troubleshoot process and equipment issues
Maintain accurate production records
Nice-to-have
Strong analytical and problem-solving skills
Excellent communication and interpersonal skills
Ability to foster collaborative work environment
Strategic planning for department goals
Experience with cost savings initiatives
Key Requirements
Bachelor's degree in mechanical, Electronics or Electrical Engineering
Proven track record in semiconductor industry FOL or EOL processes