Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
As a Process Engineer, you'll develop and evaluate novel bonding flows enabling photonic–electronic co-integration, a critical enabler for AI and HPC systems.
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions.
Matching Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Salary
Base: $147,000.00 - $202,500.00; Bonus/Equity: Eligible for bonus and stock award programs; Benefits: Comprehensive benefits package
Skills & Requirements
Must-have
Die-to-wafer hybrid bonding process development
Surface preparation and plasma activation
High-accuracy die placement and alignment
Post-bond characterization and process evaluation
Design of experiments (DOE) and process optimization
Semiconductor processing and 2.5D/3D integration
Nice-to-have
Strong communication and interpersonal skills
Collaborative multidisciplinary teamwork
Hands-on experience with state-of-the-art equipment
Self-starter with problem-solving skills
Key Requirements
M.S. or Ph.D. in Materials Science or related STEM discipline
In-depth knowledge of die-to-wafer or wafer-to-wafer bonding
Proficiency in statistical analysis and process control
Experience with thin-die handling and alignment-critical processes