Ic Packaging Engineer

NVIDIA

Israel
2+ years semiconductor packaging experience
Basic design skills with cad applications
High awareness for quality and manufacturability
NVIDIA is seeking a passionate Package Engineer to join their team in Israel

Job Summary

  • NVIDIA is seeking a passionate Package Engineer to join their team in Israel.
  • You will collaborate with design and program teams to develop sophisticated IC substrates.
  • NVIDIA offers a diverse and supportive environment for innovation and growth.

Matching Summary

NVIDIA is seeking a passionate Package Engineer to join their team in Israel.

Skills & Requirements

Must-have

  • 2+ years semiconductor packaging experience
  • Basic design skills with CAD applications
  • High awareness for quality and manufacturability

Nice-to-have

  • Hands-on FEA mechanical simulation experience
  • Team project management skills
  • Experience with manufacturing statistics tools

Key Requirements

  • BSc in Mechanical/Material Engineering or equivalent
  • Experience in DFM and tooling design
  • Leadership skills for cross-functional projects

Work Rights

Not specified

Tailored Resume

Cover Letter