Senior Wet Etch Manufacturing Development Engineer

Intel

Hillsboro, Oregon, United States
Base: $155,520.00-298,440.00 usd annually; bonus/e...
Hybrid
7+ years semiconductor manufacturing experience
Design of experiments doe and spc
Root-cause analysis with data analytics
This role bridges the gap between breakthrough technology development and high-volume manufacturing within Intel's MDCE organization

Job Summary

  • This role bridges the gap between breakthrough technology development and high-volume manufacturing within Intel's MDCE organization.
  • You will drive technology innovation by developing next-generation device architectures and supporting high-volume production scaling.
  • The position offers a competitive compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

This role bridges the gap between breakthrough technology development and high-volume manufacturing within Intel's MDCE organization.

Salary

Base: $155,520.00-298,440.00 USD annually; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 7+ years semiconductor manufacturing experience
  • Design of Experiments DOE and SPC
  • Root-cause analysis with data analytics
  • Module integration across etch deposition CMP lithography
  • Process optimization and defect reduction
  • Hands-on advanced manufacturing processes

Nice-to-have

  • Post Graduate degree in STEM field
  • Experience with sub-10nm logic nodes
  • Collaboration with equipment and materials suppliers
  • Cross-functional leadership for yield improvements
  • Mentoring junior engineers
  • Strong ownership mindset from concept to factory

Key Requirements

  • Bachelor's degree in Chemical Engineering or related STEM field
  • 7+ years of semiconductor process development experience
  • 2+ years experience in root-cause analysis capabilities
  • 2+ years experience with module integration

Work Rights

Not specified

Tailored Resume

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