Advanced Packaging Process Support Engineer

Applied Materials Inc

Hwaseong, South Korea
Hybrid
5-10 years semiconductor process engineering experience
Bachelor's degree in materials science or engineering
Willingness to work night shifts and rotational schedules
This role supports Applied Materials KINEX bonding equipment in advanced semiconductor packaging environments

Job Summary

  • This role supports Applied Materials KINEX bonding equipment in advanced semiconductor packaging environments.
  • The engineer will act as a process owner for Hybrid Bonding technologies, working closely with customer engineering teams.
  • Candidates must be willing to work in shift-based environments including night shifts within on-site fab settings.

Matching Summary

This role supports Applied Materials KINEX bonding equipment in advanced semiconductor packaging environments.

Skills & Requirements

Must-have

  • 5-10 years semiconductor process engineering experience
  • Bachelor's degree in Materials Science or Engineering
  • Willingness to work night shifts and rotational schedules
  • On-site technical support for KINEX bonding systems
  • Experience with die-to-wafer bonding technologies

Nice-to-have

  • Strong communication and interpersonal skills
  • Ability to perform in physically demanding fab environments
  • English proficiency for global collaboration
  • Master's degree or PhD in related field
  • Experience with Applied Materials KINEX systems

Key Requirements

  • 5-10 years of experience in semiconductor process engineering
  • Bachelor's degree in Materials Science, Chemistry, Electrical/Electronics Engineering, or Semiconductor Engineering
  • Experience with Hybrid Bonding (Hybrid Cu / Hybrid Capa bonding)
  • TCV bonding process experience preferred
  • General backend packaging process experience preferred

Work Rights

Not specified

Tailored Resume

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