Responsible to develop package to secure robust manufacturability, meet Quality requirements, Reliability, finance goal, product performance, Cost and Schedule
Job Summary
Responsible to develop package to secure robust manufacturability, meet Quality requirements, Reliability, finance goal, product performance, Cost and Schedule.
Conduct DFM (Design for Manufacturing) review by holding technical and financial leadership for package development working with project member such like Industrial Engineering, Finance, SCM, Purchasing, Process Engineering, QA, Program management, Human resource, Facility, and manufacturing.
To lead project team members to deliver package development goals.
Matching Summary
Responsible to develop package to secure robust manufacturability, meet Quality requirements, Reliability, finance goal, product performance, Cost and Schedule.
Skills & Requirements
Must-have
Power Semiconductor Package Development
Automotive Power Module Package
Advanced Product Qualification Plan (APQP)
Design Rule and updated Design Rule
customer requirements, application, EHS
development documents deliverables
process optimization, failure analysis
Design for Manufacturing (DFM) review
project progress, risk of delay, constraints
Nice-to-have
Self-motivated, independent, open mind
willing to take risk and managing
written English and speaking
multi-cultural foreign engineers
Key Requirements
Longer than 8 years in Semiconductor Package Development
longer than 5years with master degree
Semiconductor Package Development, Assembly Process Development