Research Engineer (Temporary Bonding and Debonding) (APM), IME
A*STAR RESEARCH ENTITIES
Singapore, Singapore
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Temporary bonding and debonding process development
Wafer-to-wafer bonding expertise
Design of experiments (doe) execution
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A*STAR Research Entities is seeking a Research Engineer for a temporary role in the Wafer-to-Wafer Bonding Module, focused on developing and optimizing temporary bonding and debonding processes in semiconductor packaging. Candidates should possess relevant academic qualifications and experience in advanced packaging technologies, alongside strong analytical and teamwork skills.
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Job Summary
This role focuses on developing and optimizing temporary bonding and debonding processes essential for advanced semiconductor packaging.
The engineer will plan and execute Design of Experiments to resolve defects such as voids, warpage, and delamination.
Candidates must be able to work within a cleanroom environment and handle precision equipment for wafer-level packaging.
Matching Summary
Match Score: 75
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A*STAR Research Entities is seeking a Research Engineer for a temporary role in the Wafer-to-Wafer Bonding Module, focused on developing and optimizing temporary bonding and debonding processes in semiconductor packaging. Candidates should possess relevant academic qualifications and experience in advanced packaging technologies, alongside strong analytical and teamwork skills.
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Skills & Requirements
Must-have
Temporary Bonding and Debonding process development
Wafer-to-Wafer bonding expertise
Design of Experiments (DOE) execution
Cleanroom environment work capability
Defect resolution for voids and warpage
Nice-to-have
Advanced packaging technology experience
Laser debonding integration knowledge
Strong analytical problem-solving abilities
Effective communication and teamwork skills
Key Requirements
Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering
Experience in TBDB process development is an advantage