Ic Packaging Manager

Blue Origin

San Diego, CA, USA
Ca applicants is $230,773.00 - $323,081.85; wa app...
On-site
Ic packaging solutions for rf/mmwave, ms, and digital asics
Package-level em, si, and thermal simulations
Package co-optimization across antenna, pcb, and die
Spearhead the IC packaging team focused on advanced packaging technologies for mmWave AiPs and complex SoCs

Job Summary

  • Spearhead the IC packaging team focused on advanced packaging technologies for mmWave AiPs and complex SoCs.
  • Build and lead the package engineering team to deliver state-of-the-art packaging solutions for various RF/mmWave, MS, and Digital ASICs.
  • Benefits include Medical, dental, vision, 401(k) with company match, and paid parental leave.

Matching Summary

Spearhead the IC packaging team focused on advanced packaging technologies for mmWave AiPs and complex SoCs.

Salary

CA applicants is $230,773.00 - $323,081.85; WA applicants is $230,773.00 - $323,081.85; Other site ranges may differ

Skills & Requirements

Must-have

  • IC packaging solutions for RF/mmWave, MS, and Digital ASICs
  • Package-level EM, SI, and thermal simulations
  • Package co-optimization across antenna, PCB, and die
  • OSAT partnership for mass production capabilities
  • Package qualification process oversight

Nice-to-have

  • Mentoring early career engineers
  • Developing radiation-tolerant/hardened packages
  • Experience with beamformers & phased array implementation

Key Requirements

  • 12+ years of experience in mass-volume IC package development
  • Advanced degree (MS/PhD) in Electrical Engineering or related field
  • Extensive experience with thermal, electromagnetic, and signal integrity simulations
  • Knowledge of SiP, AiP, and MCM implementations
  • Expertise in 2.5D/3D EM simulators and package design software

Work Rights

Must be a U.S. citizen or national, U.S. permanent resident, or lawfully admitted into the U.S.

Tailored Resume

Cover Letter