Lean Manufacturing Engineer

Teledyne Micropac

High-reliability microelectronics manufacturing
Process stability and yield improvement
Lean, six sigma, structured problem-solving
Provide hands-on technical leadership to develop, optimize, and sustain high-reliability microelectronics manufacturing processes

Job Summary

  • Provide hands-on technical leadership to develop, optimize, and sustain high-reliability microelectronics manufacturing processes.
  • Partner closely with engineering, quality, and manufacturing teams to support new product introductions, process changes, and continuous improvement initiatives.
  • Lead and support continuous improvement initiatives focused on yield, scrap reduction, throughput, cost, and process stability.

Matching Summary

Provide hands-on technical leadership to develop, optimize, and sustain high-reliability microelectronics manufacturing processes.

Skills & Requirements

Must-have

  • High-reliability microelectronics manufacturing
  • Process stability and yield improvement
  • Lean, Six Sigma, structured problem-solving
  • Microelectronics assembly processes
  • Cross-functional team coordination

Nice-to-have

  • Thrive on making an impact
  • Excitement of being on a winning team
  • Collaborative, mission-driven work environment

Key Requirements

  • Associate’s degree in engineering
  • 10-15 years of experience
  • Hands-on microelectronics manufacturing experience
  • Lean Six Sigma Green Belt or similar certification
  • Experience in regulated manufacturing environments

Work Rights

Not specified

Tailored Resume

Cover Letter