Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel

Phoenix, Arizona, United States
Base: $220,320.00-311,040.00 usd; bonus/equity: st...
10+ years industry experience
5+ years in semiconductor packaging
Bachelor's or master's degree in engineering
Intel Foundry is seeking a highly experienced Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key customers

Job Summary

  • Intel Foundry is seeking a highly experienced Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key customers.
  • The role involves owning the end-to-end customer relationship, providing technical consultation on packaging solutions, and driving execution across schedule and quality.
  • Employees receive a competitive total compensation package including stock bonuses, health benefits, retirement plans, and vacation time.

Matching Summary

Intel Foundry is seeking a highly experienced Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key customers.

Salary

Base: $220,320.00-311,040.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging
  • Bachelor's or Master's Degree in Engineering

Nice-to-have

  • Strong communication skills
  • Cross-functional collaboration
  • Willingness to travel

Key Requirements

  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging
  • Bachelors or Masters Degree in Electrical Engineering
  • Position of Trust background investigation required

Work Rights

Not specified

Tailored Resume

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