Semicon AOI Process Senior/Engineer

PEOPLE PROFILERS PTE. LTD.

Singapore
Competitive remuneration; comprehensive benefits; ...
Not specified
Aoi inspection condition development
Reflow process parameter optimization
Defect analysis for bump rdl tsv
The job posting is for a Semicon AOI Process Senior/Engineer at PEOPLE PROFILERS PTE. LTD. in Singapore, focusing on developing and optimizing AOI and reflow process technologies for advanced semiconductor packaging. The ideal candidate should have a background in engineering or science, with a minimum of 3 years of relevant experience

Job Summary

  • The role involves developing and optimizing AOI and reflow process technologies to ensure stable mass production and high product quality in advanced packaging lines.
  • Candidates will be responsible for configuring AOI inspection algorithms, setting up process conditions for new packages, and conducting root cause analysis for process issues.
  • Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Matching Summary

Match Score: 85

The job posting is for a Semicon AOI Process Senior/Engineer at PEOPLE PROFILERS PTE. LTD. in Singapore, focusing on developing and optimizing AOI and reflow process technologies for advanced semiconductor packaging. The ideal candidate should have a background in engineering or science, with a minimum of 3 years of relevant experience.

Salary

Competitive remuneration; Comprehensive benefits; Not specified

Skills & Requirements

Must-have

  • AOI inspection condition development
  • Reflow process parameter optimization
  • Defect analysis for bump RDL TSV
  • 2D/3D AOI system operation
  • Root cause analysis implementation
  • Solder micro bump quality analysis

Nice-to-have

  • Advanced packaging experience 2.5D fan-out flip-chip
  • Knowledge of APQP FMEA 8D methodology
  • Experience with KLA onto Camtek equipment
  • Customer technical evaluation support

Key Requirements

  • Bachelor's degree in Engineering or Science
  • Minimum 3 years experience in AOI or reflow process
  • Experience in advanced packaging processes like 2.5D or flip-chip

Work Rights

Not specified

Tailored Resume

Cover Letter