Senior Technical Solutions Engineer - Advanced Packaging

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $160,980.00-311,040.00 usd annually; bonus/e...
Hybrid
5+ years semiconductor experience
Bachelor's degree in engineering
Advanced packaging technologies knowledge
This role serves as the primary customer interface for key Packaging and Test accounts at Intel Foundry Services

Job Summary

  • This role serves as the primary customer interface for key Packaging and Test accounts at Intel Foundry Services.
  • The position requires expert technical consultation on advanced packaging solutions including 2.5D/3D, Chiplets, and HBM technologies.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

This role serves as the primary customer interface for key Packaging and Test accounts at Intel Foundry Services.

Salary

Base: $160,980.00-311,040.00 USD annually; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation provided

Skills & Requirements

Must-have

  • 5+ years semiconductor experience
  • Bachelor's degree in Engineering
  • Advanced Packaging Technologies knowledge
  • Customer relationship management skills
  • Statement of Work development

Nice-to-have

  • Post graduate degree in Engineering
  • Experience with 2.5D/3D and Chiplets
  • Project management and travel flexibility
  • Strong problem-solving analytical thinking
  • Yield analysis and failure analysis methodologies

Key Requirements

  • Bachelor's degree in Electrical, Materials, Mechanical, or Chemical Engineering
  • 8+ years of Semiconductor industry experience
  • Not eligible for Intel immigration sponsorship

Work Rights

Not specified

Tailored Resume

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