Senior Manager, Semi Packaging Engineering

Analog Devices

Base: $148,800 to $204,600; bonus: discretionary p...
Not specified (assumed standard office-based)
15+ years semiconductor packaging experience
3+ years people leadership experience
Mems and rf module integration knowledge
Analog Devices is seeking a Senior Manager of Semiconductor Packaging Engineering to lead the packaging strategy for MEMS and RF modules. The ideal candidate will have extensive experience in semiconductor packaging, people leadership, and technical program management

Job Summary

  • This role is accountable for building and leading a high-performing team of individual contributors while driving cross-functional alignment for reliable module packaging solutions.
  • The successful candidate will drive the technology roadmap for MEMS and RF modules from concept through high-volume manufacturing in partnership with global stakeholders.
  • Analog Devices offers a competitive salary range, discretionary performance-based bonus, and comprehensive benefits including medical, vision, dental, and 401k coverage.

Matching Summary

Match Score: 85

Analog Devices is seeking a Senior Manager of Semiconductor Packaging Engineering to lead the packaging strategy for MEMS and RF modules. The ideal candidate will have extensive experience in semiconductor packaging, people leadership, and technical program management.

Salary

Base: $148,800 to $204,600; Bonus: Discretionary performance-based bonus available; Benefits: Medical, vision, dental, 401k, paid vacation, holidays, sick time

Skills & Requirements

Must-have

  • 15+ years semiconductor packaging experience
  • 3+ years people leadership experience
  • MEMS and RF module integration knowledge
  • OSAT vendor engagement and governance
  • Cross-functional program management

Nice-to-have

  • Design-to-cost optimization skills
  • Strong influence on executive stakeholders
  • Experience with failure analysis tools

Key Requirements

  • Master's degree or PhD in Engineering or Materials Science
  • 15+ years in semiconductor packaging and assembly engineering
  • 3+ years of people leadership experience
  • US Citizenship or Permanent Resident status required for export control

Work Rights

Must be US Citizen, US Permanent Resident, or protected individual

Tailored Resume

Cover Letter