Silicon Photonics Packaging Technical Leader

Cisco UK

Base: $148,800 - $212,900 (varies by location); bo...
Hybrid
Advanced silicon photonic package technology
Substrate design and chip fabrication experience
Signal and power integrity analysis
Cisco UK is seeking a Silicon Photonics Packaging Technical Leader to drive the development and qualification of advanced packaging solutions for optical transceiver products. The ideal candidate will have a strong background in photonics or semiconductor packaging, with significant experience in advanced packaging technologies and team leadership

Job Summary

  • This role serves as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT) providers to drive advanced package assembly and qualification.
  • The successful candidate will lead the design of test vehicles, conduct rigorous design reviews for complex substrates, and establish best-in-class quality and reliability standards across the supply chain.
  • Cisco offers a comprehensive benefits package including medical, dental, vision insurance, a 401(k) plan with matching contributions, paid parental leave, and flexible vacation time for exempt employees.

Matching Summary

Match Score: 85

Cisco UK is seeking a Silicon Photonics Packaging Technical Leader to drive the development and qualification of advanced packaging solutions for optical transceiver products. The ideal candidate will have a strong background in photonics or semiconductor packaging, with significant experience in advanced packaging technologies and team leadership.

Salary

Base: $148,800 - $212,900 (varies by location); Bonus/Equity: Annual bonuses and restricted stock units available; Benefits: Medical, dental, vision, 401(k), paid leave, and wellness days

Skills & Requirements

Must-have

  • Advanced Silicon Photonic package technology
  • Substrate design and chip fabrication experience
  • Signal and power integrity analysis
  • Cadence, klayout, or Ansys simulation tools
  • 2.5D/3D integration and flip-chip processes

Nice-to-have

  • Co-packaged optics experience
  • Volume manufacturing background
  • Mechanical and thermal modeling skills
  • 8D problem-solving methodology
  • Cross-functional team leadership

Key Requirements

  • Masters Degree in Engineering/Physics with 8+ years experience OR PhD with 3+ years
  • Proven experience in advanced Silicon Photonic package technology development
  • Experience with industry-standard design and simulation software

Work Rights

Not specified

Tailored Resume

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