Advanced Ic Packaging Software Engineer

Intel Corporation

Phoenix, Arizona, United States
Base: $111,030.00-211,200.00 usd; bonus/equity: st...
Hybrid
Advanced ic packaging software
Design tools and flows
System co-design
Intel Foundry is establishing a fully vertical, stand-alone foundry business reporting directly to the CEO, aiming to be a world-class foundry and major provider of US-based capacity

Job Summary

  • Intel Foundry is establishing a fully vertical, stand-alone foundry business reporting directly to the CEO, aiming to be a world-class foundry and major provider of US-based capacity.
  • The Advanced IC Packaging Software Engineer will work closely with Intel foundry customers on advanced packaging technologies to define, develop, and implement design tools, flows, automation, and methodologies.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Intel Foundry is establishing a fully vertical, stand-alone foundry business reporting directly to the CEO, aiming to be a world-class foundry and major provider of US-based capacity.

Salary

Base: $111,030.00-211,200.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Advanced IC Packaging Software
  • Design Tools and Flows
  • System Co-design
  • Software Development Methodologies
  • Secure Coding Practices

Nice-to-have

  • Self-driven and results-oriented
  • Analytical problem-solving skills
  • Effective communication skills
  • Collaborating with stakeholders and customers
  • AI and ML fundamentals

Key Requirements

  • Bachelor's Degree + 2 years experience
  • Master's Degree + 1 year experience
  • Experience with C/C++
  • Experience with EDA Tools
  • Scripting experience (tcl, Python, SKILL, VBScript, Perl)

Work Rights

Not specified

Tailored Resume

Cover Letter