Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms
Job Summary
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
Matching Summary
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Salary
$131,900.00 - $241,500.00
Skills & Requirements
Must-have
Silicon Photonics packaging architectures
Fiber attach and photonic die placement
Heterogeneous integration (HI)
Multiphysics simulations
Root cause analysis for yield issues
Mass production readiness and process transfer
Nice-to-have
Automated optical/electro-optical test setups
Co-packaged optics (CPO) ecosystem knowledge
Thermal/mechanical modeling and optical simulation tools
Cross-functional team leadership
Key Requirements
Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
15+ years of experience in semiconductor packaging
Hands-on experience with fiber attach processes
Familiarity with packaging technologies
Understanding of reliability standards
Experience bringing packaged products from development into production