Principal Engineer, Advanced Packaging

Micron

Boise, ID, United States
Hybrid
5+ years in semiconductor packaging
Expertise in high bandwidth memory
Hands-on process module engineering experience
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • As a Principal Engineer, you will shape next-generation semiconductor packaging technologies.
  • Micron is dedicated to your personal wellbeing and professional growth.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • 5+ years in semiconductor packaging
  • Expertise in High Bandwidth Memory
  • Hands-on process module engineering experience

Nice-to-have

  • Understanding of DRAM wafer structure
  • Proficiency in an East Asian language
  • Track record of innovation

Key Requirements

  • BS, MS, or PhD in related field
  • Experience in DRAM manufacturing
  • Mentoring other engineers

Work Rights

Not specified

Tailored Resume

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