Advanced Packaging Yield Analysis And Defect Engineer

Intel Corporation

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00; bonus/equity: not sp...
On-site
Data analysis with jmp or python
Statistical methods and machine learning
Understanding of electrical and physical fails
Drive yield and defect improvement across the APTM portfolio of packaging technologies

Job Summary

  • Drive yield and defect improvement across the APTM portfolio of packaging technologies.
  • Extract insights from large datasets using statistical methods and machine learning.
  • Develop solutions by leveraging manufacturing process knowledge and problem-solving tools.

Matching Summary

Drive yield and defect improvement across the APTM portfolio of packaging technologies.

Salary

Base: $141,910.00-269,100.00; Bonus/Equity: Not specified; Benefits: Included

Skills & Requirements

Must-have

  • Data analysis with JMP or Python
  • Statistical methods and machine learning
  • Understanding of electrical and physical fails
  • Inline defect metrology knowledge
  • Cross-functional partnership development

Nice-to-have

  • Tolerance of ambiguity
  • High performing team culture
  • Autonomous work capability

Key Requirements

  • Bachelor's degree with 6+ years of experience
  • Master's degree with 4+ years of experience
  • PhD degree with 2+ years of experience
  • 5+ years of experience in data analysis
  • US Citizenship Required

Work Rights

US Citizenship Required

Tailored Resume

Cover Letter