Lead CHIP/Substrate/OSAT/PCB qualification for Networking products (2nd source) and collaborate with engineering teams to define qualification plans
Job Summary
Lead CHIP/Substrate/OSAT/PCB qualification for Networking products (2nd source) and collaborate with engineering teams to define qualification plans.
Coordinate and lead changes through the ECR/CCB process, track activities, manage timelines, and ensure successful qualification completion.
Develop and implement project management processes to improve tracking, clarity, execution, and operational efficiency, utilizing systems for data management and task tracking.
Matching Summary
Lead CHIP/Substrate/OSAT/PCB qualification for Networking products (2nd source) and collaborate with engineering teams to define qualification plans.
Skills & Requirements
Must-have
CHIP and PCB NPI activities
cross-functional efforts
program management skills
risk management methodologies
Power BI and advanced systems
Nice-to-have
strong technical understanding
proactive mindset
attention to detail
working hour flexibility
good interpersonal skills
Key Requirements
B.Sc. in Industrial engineering, Material or Chemical engineering or related field