$154,000.00 - $212,000.00; not specified; not spec...
Hybrid
Advanced packaging w2w/d2w bonding
Micro bumps, tsv, thermal management
Optics and multi-wafer stacking
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.
Matching Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Salary
$154,000.00 - $212,000.00; Not specified; Not specified
Skills & Requirements
Must-have
Advanced packaging W2W/D2W bonding
Micro bumps, TSV, thermal management
Optics and multi-wafer stacking
New materials and process development
Structured problem-solving methodology
Define and develop differentiated modules
Nice-to-have
Supportive work culture
Continuous learning and development
Pushing boundaries of possibility
Thought leader for roadmap definition
Key Requirements
BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
5 years of experience in advanced packaging
Experience with MES systems for Si fab processing is a plus