Fab C4/bumping Module Engineer

Intel Corporation

Hillsboro, Oregon, US
Base: $120,860.00-231,670.00 usd; bonus/equity: st...
Hybrid
Equipment and process optimization
300mm toolsets
Thick metal/via layers
Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth

Job Summary

  • Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.
  • The Wafer Packaging Manufacturing (WPM) organization drives Intel's advanced packaging strategy, enabling large-scale AI computing and owning crucial semiconductor manufacturing processes.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.

Salary

Base: $120,860.00-231,670.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Equipment and process optimization
  • 300mm toolsets
  • Thick metal/via layers
  • Bumping, reflow, thinning, backside metallization
  • Safety, tool health and matching
  • Process health and matching
  • Excursion prevention and response

Nice-to-have

  • Data-driven problem solving
  • High-performing culture
  • Execution with urgency
  • Personal ownership
  • Thrive in dynamic environments
  • Teamwork and leadership skills
  • Excellent communication and influencing skills

Key Requirements

  • Bachelor's Degree in STEM field
  • 6+ years semiconductor engineering experience
  • Advanced degree or 10+ years experience (preferred)
  • Knowledge of statistics and experimental design (preferred)
  • Strong data analysis and troubleshooting skills (preferred)
  • Ability to work across organizational boundaries (preferred)

Work Rights

Not specified

Tailored Resume

Cover Letter