You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals
Job Summary
You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
You will work closely with package design & technology, test & product engineering, production planning, quality engineering & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
Plan, drive & implement improvement activities for continual improvement, second sourcing, cost reduction & customer satisfaction.
Matching Summary
You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
Skills & Requirements
Must-have
silicon bumping process management
package assembly supplier coordination
process improvement and change management
product life-cycle management
project management experience
failure analysis and TQM
AutoCAD proficiency
Nice-to-have
good analytical and problem-solving skills
flexible and agile work approach
knowledge of silicon and PCB fabrication
experience with board assembly processes
effective communication with global teams
Key Requirements
PhD/Master/Degree in Mechanical/Electrical/Electronics Engineering
7 to 12 years relevant experience
experience managing advanced node silicon bumping and multi-chip package assembly
experience with substrate and back-end suppliers and processes