Senor Wire Bonding Manufacturing / Process Development Engineer

Teledyne Technologies Incorporated

Unknown
Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding process expertise
Process development and optimization
Statistical analysis and doe
The engineer is responsible for developing and sustaining automated wire bonding processes to ensure quality and reliability in microelectronics manufacturing

Job Summary

  • The engineer is responsible for developing and sustaining automated wire bonding processes to ensure quality and reliability in microelectronics manufacturing.
  • This role involves hands-on support, continuous improvement initiatives, and collaboration across Design, Quality, Manufacturing Engineering, and Supply Chain teams.
  • Teledyne Technologies is committed to high ethical standards and equal opportunity employment, fostering a culture of innovation and integrity.

Matching Summary

The engineer is responsible for developing and sustaining automated wire bonding processes to ensure quality and reliability in microelectronics manufacturing.

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • automated wire bonding process expertise
  • process development and optimization
  • statistical analysis and DOE
  • equipment troubleshooting and maintenance
  • process control and compliance
  • cross-functional collaboration

Nice-to-have

  • experience with MES systems
  • lean manufacturing and 5S
  • digital process documentation
  • strong communication and training skills
  • knowledge of aerospace and defense standards

Key Requirements

  • Bachelor’s degree in engineering or related field
  • 3+ years experience in microelectronics manufacturing
  • US Citizenship or PERM Resident status required

Work Rights

Must have US citizenship or PERM Resident status

Tailored Resume

Cover Letter