Assembly Technical Program Manager

NXP USA INC.

Bangkok, Thailand
Mold process expertise
Lean six sigma optimization
Process validation methodologies
The role requires excellence in mold and backend processes of semiconductor manufacturing

Job Summary

  • The role requires excellence in mold and backend processes of semiconductor manufacturing.
  • You will lead improvement projects focused on quality, cost, and delivery metrics.
  • The position involves troubleshooting and optimizing molding processes while collaborating with cross-functional teams.

Matching Summary

The role requires excellence in mold and backend processes of semiconductor manufacturing.

Skills & Requirements

Must-have

  • Mold process expertise
  • Lean Six Sigma optimization
  • Process validation methodologies

Nice-to-have

  • Effective communication in Thai and English
  • Proactive project management skills
  • Leadership in continuous improvement

Key Requirements

  • Bachelor’s or Master’s degree in relevant engineering
  • Over 10 years in semiconductor industry
  • Minimum 10 years in high precision injection molding

Work Rights

Not specified

Tailored Resume

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