Senior Thermo Compression Bonding (TCB) Engineer [ Advanced Semiconductor Packaging | HBM | CoWoS | 2.5D / 3D Packaging ] - 8890

THE SUPREME HR ADVISORY PTE. LTD.

D01 Cecil, Marina, People’s Park, Raffles Place, 3 SHENTON WAY SHENTON HOUSE 068805
Sgd 7,000 - 10,000 / monthly pm
On-site
Electronics packaging
Materials science
Vision systems
The job posting seeks a Senior Thermo Compression Bonding (TCB) Engineer for advanced semiconductor packaging at THE SUPREME HR ADVISORY PTE. LTD. in Singapore. The ideal candidate should have extensive semiconductor packaging experience and a strong technical background in TCB processes, alongside customer engagement and troubleshooting skills

Job Summary

  • Support technical sales activities and customer discussions
  • Benchmark competitor equipment and identify technology gaps
  • Translate customer requirements into internal equipment specifications

Matching Summary

Match Score: 85

The job posting seeks a Senior Thermo Compression Bonding (TCB) Engineer for advanced semiconductor packaging at THE SUPREME HR ADVISORY PTE. LTD. in Singapore. The ideal candidate should have extensive semiconductor packaging experience and a strong technical background in TCB processes, alongside customer engagement and troubleshooting skills.

Salary

SGD 7,000 - 10,000 / Monthly

Skills & Requirements

Must-have

  • Electronics Packaging
  • Materials Science
  • Vision Systems
  • Semiconductor Industry
  • IDM

Nice-to-have

  • DOE
  • Yield Management
  • Packaging
  • Packaging Engineering
  • Technical Sales Support
  • Electrical Engineering
  • Process Analytical Technology
  • Mechanical Engineering
  • Thermal Engineering
  • Wet Chemistry
  • Failure Analysis
  • Thermal
  • Analyzing Customer Requirements

Key Requirements

  • Minimum 5 years experience

Work Rights

Tailored Resume

Cover Letter