Assembly Process & NPI Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

Yishun, Singapore
Not specified
7-12 years managing advanced node silicon bumping
Experience with 2.5/3d package assembly processes
Hands on product life-cycle management skills
AVAGO TECHNOLOGIES is seeking an Assembly Process & NPI Engineer in Yishun, Singapore, responsible for managing silicon bump and package assembly suppliers while supporting new product introductions. The ideal candidate will have a strong engineering background, project management experience, and a commitment to continuous improvement

Job Summary

  • You are responsible to drive and manage the silicon Bump & package assembly suppliers to achieve aggressive TQRDCEB goals.
  • The role requires defining processes, monitoring systems, and managing process improvements while supporting new product introduction activities.
  • Candidates must have hands-on experience in creating Bill of Material structures and maintaining Process Documentation.

Matching Summary

Match Score: 85

AVAGO TECHNOLOGIES is seeking an Assembly Process & NPI Engineer in Yishun, Singapore, responsible for managing silicon bump and package assembly suppliers while supporting new product introductions. The ideal candidate will have a strong engineering background, project management experience, and a commitment to continuous improvement.

Skills & Requirements

Must-have

  • 7-12 years managing advanced node silicon bumping
  • Experience with 2.5/3D package assembly processes
  • Hands on Product Life-Cycle Management skills
  • Knowledge of substrate and back-end supplier management
  • Proficiency in failure analysis tools and TQM

Nice-to-have

  • Flexible and agile team player
  • Result oriented individual
  • Good analytical problem-solving skills
  • Travel availability at short notice
  • Knowledge of emerging silicon package technologies

Key Requirements

  • PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering
  • 7~12 years relevant experience in advanced node packaging
  • Experienced AutoCAD user
  • Knowledge of silicon & PCB fabrication processes

Work Rights

Not specified

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