Fab C4/bumping Module Engineer

Intel

Hillsboro, Oregon, US
Base: $120,860.00-231,670.00 usd; bonus/equity: st...
Hybrid
Semiconductor wafer processing
Thick metal/via layers
Bumping and reflow
Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth

Job Summary

  • Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.
  • The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy.
  • We offer competitive salary and financial benefits as well as programs that promote health and well-being.

Matching Summary

Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.

Salary

Base: $120,860.00-231,670.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • semiconductor wafer processing
  • thick metal/via layers
  • bumping and reflow
  • thinning and backside metallization
  • equipment and process optimization
  • sustaining responsibilities

Nice-to-have

  • high-performing culture
  • execution with urgency
  • data-driven problem solving
  • thrive in dynamic environment
  • teamwork and leadership skills
  • excellent communication skills

Key Requirements

  • Bachelor's Degree in STEM
  • 6+ years semiconductor experience
  • Advanced degree or 10+ years experience
  • Knowledge of statistics and DOE
  • Strong data analysis acumen
  • Strong technical troubleshooting skills

Work Rights

Not specified

Tailored Resume

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