Wire Bonding Technician

Teledyne Technologies Incorporated

Base: $44,500.00-$59,300.00; bonus/equity: not spe...
Manual ball and wedge bonding setup
Automatic wire bonder operation
Microscope work with hand-eye coordination
The role involves performing precise wire bonding of Focal Plane Arrays and silicon readout devices for advanced infrared sensors used in space and defense applications

Job Summary

  • The role involves performing precise wire bonding of Focal Plane Arrays and silicon readout devices for advanced infrared sensors used in space and defense applications.
  • Candidates must possess the ability to work under a microscope with excellent hand-eye coordination while adhering to strict Quality Assurance requirements.
  • The company offers a competitive salary, comprehensive health benefits from day one, and opportunities for educational tuition reimbursement.

Matching Summary

The role involves performing precise wire bonding of Focal Plane Arrays and silicon readout devices for advanced infrared sensors used in space and defense applications.

Salary

Base: $44,500.00-$59,300.00; Bonus/Equity: Not specified; Benefits: Health, Dental, Vision, Life Insurance, 401(k) match, Stock Purchase Plan

Skills & Requirements

Must-have

  • Manual ball and wedge bonding setup
  • Automatic wire bonder operation
  • Microscope work with hand-eye coordination
  • Electrostatic discharge (ESD) control familiarity
  • Quality Assurance inspection procedures

Nice-to-have

  • Experience with infrared sensor technology
  • Collaborative team environment
  • Agility in mission-focused teams

Key Requirements

  • High School Diploma or Associate's degree
  • 3-5 years of relevant experience
  • U.S. Citizenship required

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter