The role focuses on developing innovative inspection and metrology techniques to enable advanced packaging technologies for high-performance memory products
Job Summary
The role focuses on developing innovative inspection and metrology techniques to enable advanced packaging technologies for high-performance memory products.
Candidates will be responsible for identifying root causes of defects, proposing yield breakthroughs, and establishing equipment evaluation strategies.
The position requires close collaboration with global teams including Package Integration, Assembly Engineering, and Product Engineering to ensure seamless technology integration.
Matching Summary
The role focuses on developing innovative inspection and metrology techniques to enable advanced packaging technologies for high-performance memory products.
Skills & Requirements
Must-have
Metrology recipe development and optimization
Python, R, SQL for statistical analysis
Wafer bonding and packaging process experience
SPC and OCAP control plan implementation
Defect analysis and yield improvement strategies
Nice-to-have
Experience with Visual Basic for automation
Familiarity with E3, FDC, and RMS systems
Strong problem-solving under tight timelines
Cross-functional collaboration skills
Power BI dashboarding capabilities
Key Requirements
B.S./M.S./Ph.D. in Engineering or Physics
2+ years semiconductor process or equipment engineering experience
Hands-on experience with wafer/assembly tools or metrology systems