Ic Packaging Engineer

NVIDIA

Israel
Microelectronics packaging development
Packaging manufacturing readiness
Substrate and assembly production kpis
Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance

Job Summary

  • Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
  • Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
  • NVIDIA offers highly competitive salaries and a comprehensive benefits package.

Matching Summary

Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.

Skills & Requirements

Must-have

  • microelectronics packaging development
  • packaging manufacturing readiness
  • substrate and assembly production KPIs
  • process changes reviews
  • failure analysis and reliability issues

Nice-to-have

  • curious and creative problem solver
  • fostering a culture of continuous learning
  • proactive approach
  • thriving in a dynamic environment

Key Requirements

  • BSc or equivalent Mechanical/Material Engineering degree
  • 2+ years of relevant work experience
  • Basic design skills (ArtiosCAD, NX/SolidWorks/Creo)
  • Experience in DFM, tooling design, manufacturing processes
  • High awareness for quality, robustness, manufacturability
  • Leadership skills

Work Rights

Not specified

Tailored Resume

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